News
Fuji Corporation develops next-generation die bonder with 3μm bonding accuracy for debut at SEMICON China
Wednesday, March 18, 2026 at 09:39 AM
The Fuji Corporation group is unveiling a next-generation die bonder at SEMICON China, featuring a bonding accuracy of 3μm. This advancement in precision placement is aimed at the high-density semiconductor assembly market.
Context
On March 23, 2026, FUJI Corporation (through its subsidiary Fasford Technology) announced the development of its next-generation die bonder, the XERDIA, which is set to debut at SEMICON China 2026. The system achieves a high-precision bonding accuracy of 3μm, addressing the intensifying demand for advanced packaging and miniaturization in the semiconductor sector. This development follows FUJI's recent entry into the SATAS (Sustainable Alliance for Tech Automation and Standardization) to push for automation in backend manufacturing.
The launch comes as the global semiconductor market is projected by Fujifilm and WSTS to approach $772 billion in 2025, driven by AI-related investment and a recovery in the smartphone and PC segments. Fujifilm President Teiichi Goto previously emphasized this strategic shift toward the semiconductor ecosystem on November 14, 2025, stating the company plans to establish manufacturing facilities in India to serve domestic and neighboring markets. While the headline mentions Wanshih Electronic, their specific role in this product debut could not be independently verified from the provided evidence beyond their general presence in the semiconductor supply chain.
Sources (9)
PURPOSE OF PUBLICATIONSemiconductor Materials Business Briefing
How are semiconductors manufactured? | Fuji Electric Corp. of America Fujifilm to build semiconductor materials factory in India, targeting regional exportsFUJI Group's Fasford Technology to Unveil Next- ...Fuji to Soar Chip Placement Tech as New SATAS Member | AEIWanShih Electronic Co., Ltd.:Company Profile & Technical Research,Competitor Monitor,Market Trends - Discovery | PatSnapAvnet APAC: Quality Electronic Components & Services
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