News
PSMC, Intel, and SoftBank partner to develop next-generation AI memory for 2029 production
Thursday, February 19, 2026 at 09:58 AM
PSMC has entered a strategic partnership with Intel and SoftBank to develop next-generation AI memory technologies. SoftBank subsidiary Saimemory will manage design and intellectual property, Intel will provide memory architecture and stacking technology support, while PSMC and Shinko Electric will handle prototyping and manufacturing. The consortium aims for prototype completion by 2027 and commercial production by 2029 to challenge the dominance of established memory players.
Context
Intel has accelerated its push into the next-generation memory market by securing critical patents for Z-Angle Memory (ZAM), a technology developed in partnership with SoftBank Group and its subsidiary SyMemory. A new patent, US20260017215A1, details a method for selectively activating DRAM die portions to drastically reduce heat and power—the primary technical bottlenecks for current HBM solutions. By utilizing diagonal circuit routing and fewer vertical vias, Intel is building a defensive intellectual property moat to block competitors in the high-performance computing sector.
The technology aims to disrupt the AI infrastructure landscape by offering a 40% to 50% reduction in power consumption compared to conventional HBM. Intel is also leveraging its new NGDB packaging technology to improve manufacturing productivity and per-chip capacity. While Intel recently showcased a prototype at its 2026 event in Japan, full commercialization is targeted for 2029–2030, signaling a long-term strategy to challenge the dominance of incumbent memory makers through fundamental architectural innovation.
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