News
Advanced packaging sector shows growth across BESI, ASE, and Amkor
Tuesday, January 20, 2026 at 07:23 AM
Industry activity in advanced packaging is increasing across multiple major players including BE Semiconductor, ASE Technology, and Amkor Technology.
Context
The advanced packaging sector is entering an aggressive growth phase in early 2026, driven by insatiable AI demand. ASE Technology Holding is spearheading the shift with anticipated price hikes of 5% to 20% for backend services as global capacity tightens and utilization rates hover near 90%. To meet this surge, ASE is fast-tracking its Kaohsiung K18 and K28 facilities, both scheduled for 2026 operations, to absorb overflow demand for high-performance computing and CoWoS applications.
Equipment leader BESI recently confirmed a 43% sequential spike in Q4 2025 orders, reaching €250 million, fueled by the accelerating adoption of hybrid bonding for HBM4 memory. Meanwhile, Amkor posted record advanced packaging revenue of $1.68 billion in late 2025, with 2026 sales projected to climb 9.29% to $7.27 billion. This coordinated expansion across the supply chain underscores how advanced packaging has transitioned from a backend service to the critical technological bottleneck for AI infrastructure.
Related Companies
A
ASE
ASX
BESI
BESI
A
Amkor
AMKR