Rumor
Nittobo competes for NVIDIA Vera Rubin board material supply against rivals AGC and Taiwan Glass
Wednesday, February 18, 2026 at 03:25 AM
Nittobo maintains a competitive advantage in low-dielectric NE-glass materials for CCL manufacturers due to superior compatibility with copper foils and resins compared to AGC and Taiwan Glass. The company is currently competing with Quanta for board designs in the upcoming NVIDIA Vera Rubin platform, which could significantly impact production volume and pricing if successful.
Context
Nittobo is currently in a high-stakes competition to supply critical low-dielectric board materials for Nvidia’s next-generation Vera Rubin AI platform, facing off against rivals AGC and Taiwan Glass. While Nvidia is evaluating both Nittobo’s NE-glass and ultra-high-performance Q-glass (quartz) for its M9-grade copper-clad laminates, industry sentiment favors Nittobo. Manufacturers prefer the NE-glass series for its superior resin compatibility and easier processing compared to quartz alternatives, which are often more expensive and prone to manufacturing yield issues.
Winning this supply contract is expected to trigger a significant revenue multiplication effect as Vera Rubin moves toward mass production in the second half of 2026. The new architecture shifts from traditional cabling to complex, multi-layer PCBs, with layer counts jumping from 20 to over 100 layers in some units. To prepare for this demand, Nittobo is investing ¥150 billion to triple its high-end glass capacity by the end of 2026, positioning itself to dominate a specialized AI PCB market projected to reach $6.96 billion by 2027.
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