News
Samsung targets first half completion for 2nm Exynos 2700 production samples
Wednesday, March 4, 2026 at 07:44 AM
Samsung Electronics has finalized the design of the Exynos 2700 and is currently fabricating production samples with a completion target of May to June. The chip will be manufactured using Samsung's second-generation 2nm process technology. The company intends to improve thermal management by implementing an evolved version of its Heat Path Block (HPB) advanced packaging technology. Success of this node and chip design is seen as critical for increasing Samsung Foundry's internal utilization and reducing the Mobile eXperience division's reliance on external vendors like Qualcomm.
Context
Samsung Electronics is accelerating its 2nm transition, targeting the completion of Exynos 2700 production samples by May–June 2026. This next-generation mobile processor, slated for the Galaxy S27 series, follows the successful rollout of the Exynos 2600. By utilizing a second-generation 2nm foundry process, Samsung aims to achieve process yields exceeding 95%, positioning the chip to outperform Qualcomm’s flagship offerings in both GPU power and AI benchmarks.
The strategic shift aims to reduce Samsung's reliance on external suppliers like Qualcomm, which previously cost the company roughly KRW 11 trillion in annual mobile AP expenditures. Analysts project the Exynos 2700 could capture a 50% share of the Galaxy S27 series, significantly improving profitability for the MX division while validating the competitiveness of Samsung’s Foundry and System LSI units. Advanced Heat Path Block (HPB) packaging will also be integrated to enhance thermal efficiency for sustained high-performance AI tasks.
Related Companies
Qualcomm
QCOM
S
Samsung