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NOHMI Bosai Supplies Disaster Prevention System to Rapidus Semiconductor Facility
Friday, December 5, 2025 at 11:33 AM
Japanese fire and safety equipment company NOHMI Bosai announced the delivery of a disaster prevention system to the construction site of Rapidus Corporation's new semiconductor manufacturing facility. This represents a concrete step in equipping the advanced chipmaking plant.
Context
Japanese firm Nohmi Bosai has supplied a critical disaster-prevention system to Rapidus's IIM-1 manufacturing facility located in Chitose, Japan. This strategic delivery supports the development of Japan's advanced semiconductor capabilities, specifically targeting the production of cutting-edge 2-nanometer logic semiconductors. These chips are essential for next-generation technologies such as autonomous driving and artificial intelligence.
The Rapidus IIM-1 facility, which commenced construction in September 2023, is on track to have its prototype line operational by 2025. This timeline underscores the rapid progress in establishing a domestic supply chain for advanced logic chips. While specific contract values or system capacities were not disclosed, Nohmi Bosai's involvement highlights its role in ensuring the safety and operational continuity of this pivotal semiconductor production hub.
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