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DIC to invest 90 billion yen in semiconductor materials over five years
Monday, February 16, 2026 at 09:21 AM
DIC Corporation plans to pivot its business strategy toward semiconductor materials, allocating 90 billion yen for investment over the next five years following the sale of non-core assets like its art collection.
Context
DIC is executing a major strategic pivot, reallocating capital from legacy assets toward the global semiconductor supply chain. The company is liquidating non-core holdings, including its high-value art collection and liquid crystal business, to fund its transition into "chemitronics." This shift aims to capture surging demand for high-performance materials essential for AI, 5G, and advanced electronics components.
Under Phase 2 of its Vision 2030 management plan, DIC will invest 90 billion yen in semiconductor materials over the next five years. A cornerstone of this strategy is the expansion of its Chiba Plant, where it is constructing a new production facility for advanced epoxy resins used in chip packaging. This project, which recently secured a 3 billion yen government subsidy from Japan’s Ministry of Economy, Trade and Industry, positions DIC as a critical provider of the thermal and electrical insulation required for next-generation AI chip architectures.
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