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TSMC plans to reach monthly production of 15,000 N3 wafers in Japan by 2028
Tuesday, March 31, 2026 at 11:17 AM
TSMC is reportedly planning to establish manufacturing capacity for its N3 (3nm) process node in Japan. The roadmap targets a monthly production capacity of 15,000 wafers by 2028. This move signifies a significant expansion of TSMC's advanced semiconductor manufacturing footprint outside of Taiwan, specifically bringing cutting-edge node capabilities to its Japanese operations.
Context
TSMC has officially upgraded its roadmap for the second fabrication plant in Kumamoto, Japan, announcing plans to produce advanced 3-nanometer (N3) chips by 2028. This shift represents a significant technological leap from the original plan to produce 6nm to 12nm semiconductors at the site. The facility is expected to reach a monthly production capacity of 15,000 N3 wafers, bolstering Japan's domestic supply chain for high-performance computing and artificial intelligence.
The project involves a total investment of approximately $17 billion (2.6 trillion yen), supported by substantial subsidies from the Japanese government. This expansion is a cornerstone of Prime Minister Sanae Takaichi's industrial policy to secure economic security and revitalize the nation's semiconductor sector. By bringing 3nm production to Japan, TSMC aims to meet surging global demand from clients like Nvidia and Apple while diversifying its manufacturing footprint beyond Taiwan.
Sources (6)
TSMC 3nm chip plan in Japan, a win for Takaichi - Taipei TimesTSMC CEO flags 3-nanometre chip production in Japan, investment reported at $17 billion | ReutersTSMC prepares for 3nm risk productionTSMC advances Japan chip roadmap with $17B investmentTSMC CEO flags 3-nanometre chip production in Japan, investment reported at $17 billion | SemiWikiTSMC Considers Chip Manufacturing Using 3nm Process in Japan
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