News
Rigaku Launches Sub-Atomic Precision Film Thickness Measurement Tool; Kioxia Adopts
Thursday, December 4, 2025 at 08:40 AM
Rigaku has launched a new film thickness measurement device for semiconductors capable of measuring with sub-atomic-level precision. Kioxia has decided to adopt this new equipment for their operations.
Context
On December 4, 2025, Rigaku launched its new XTRAIA MF-3400, a semiconductor film-thickness metrology tool designed for next-generation manufacturing. This instrument offers sub-nanometer precision, described as "finer than the thickness of a single atom," on a 50 µm field. Crucially, it significantly boosts efficiency with measurement capability up to double that of previous devices, achieved through an enhanced X-ray dose and a new transport system.
Further solidifying its market impact, KIOXIA Corporation and KIOXIA Iwate Corporation have already decided to implement the XTRAIA MF-3400 into their mass-production lines for 3D NAND flash memory. This rapid adoption by a major memory manufacturer underscores the tool's immediate relevance and advanced capabilities for high-volume production environments.
The XTRAIA MF-3400 also supports complex material analysis, including molybdenum measurement, and integrates multiple analytical techniques such as fluorescent X-rays, X-ray reflectance, and XRD. This strategic launch positions Rigaku as a key player in providing cutting-edge metrology solutions for both memory and logic manufacturers.
Sources (6)
Rigaku Launches XTRAIA MF-3400, a Measuring ...Rigaku Launches XTRAIA MF-3400, a Measuring ...Rigaku Semiconductor Metrology Division Technology SolutionsRigaku Expands Production Facilities for the Semiconductor MarketKIOXIA AiSAQ™ and memory-centric AI innovations ...X-ray thin-film measurement techniques
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