Samsung Electronics is developing a new advanced packaging technology called Side-by-Side (SbS) for its Exynos mobile APs to improve heat dissipation and power efficiency. This technology would involve placing the AP and DRAM horizontally and integrating a Heat Path Block (HPB) on top. This FOWLP-SbS structure aims to allow for thicker chips, better heat control, and shorter signal paths, despite increasing the overall package area. Samsung is also exploring 3D packaging for Exynos in the mid-to-long term. The Exynos 2600, set for early 2025 release, already incorporates HPB to reduce heat generation.