Rumor
Broadcom Networking Backlog Reported Strong; TomaHawk 6 Uses CoWoS
Friday, December 12, 2025 at 08:26 AM
A semiconductor supply chain watcher reports that Broadcom's networking product backlog appears robust. The upcoming TomaHawk 6 switch chip is noted to utilize CoWoS advanced packaging technology.
Context
Broadcom is actively shipping and sampling its Tomahawk 6 switch series, which boasts an impressive 102.4 Tbps switching capacity and offers options for co-packaged optics (CPO). The company has reported a substantial AI-related backlog, estimated at roughly $73 billion to be fulfilled over the next 18 months, with AI switch orders alone exceeding $10 billion. Management noted that Tomahawk 6 is booking at record rates, indicating strong demand.
However, the reliance of Tomahawk 6 on TSMC's advanced CoWoS packaging technology introduces potential risks related to packaging availability and lead times. For Q1 FY26, Broadcom anticipates revenue of approximately $19.1 billion, with AI semiconductor revenue expected to double to around $8.2 billion. The company has also highlighted that gross margin mix effects and product lead times, which can range from months to a year, are important considerations for future financial performance.
Sources (26)
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