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Zhen Ding Technology plans 50 billion TWD investment for AI server and PCB capacity expansion

Saturday, February 14, 2026 at 02:59 AM

PCB manufacturer Zhen Ding Technology (Zhen Ding-KY) plans to increase its capital expenditure to 50 billion TWD by 2026 to support high-end AI applications. The company is concurrently building 10 factories across Huai'an and Thailand, focusing on intelligent HDI, high-level panels, and optical modules for AI servers. The investment aims to capture demand for high-speed computing chips and next-generation AI infrastructure platforms.

Context

PCB leader Zhen Ding Technology has announced an aggressive capital expenditure plan totaling 50 billion TWD (approx. $1.5 billion USD) through 2026 to capitalize on surging AI infrastructure demand. The company is currently constructing 10 new factories simultaneously across Thailand and Huai’an, China, while utilizing its Kaohsiung facility for high-end project validation. This massive expansion focuses on critical AI components, including intelligent HDI (iHDI), high-layer count (HLC) boards, and IC substrates required for next-generation AI servers and high-speed optical modules. The investment signals Zhen Ding’s transition into a high-growth phase, with 2025 revenue projected to reach a record 182.5 billion TWD, a 6.33% year-over-year increase. Management expects the full impact of these capacity upgrades to materialize starting in 2026, driven by demand for high-end applications like AI smart glasses, humanoid robots, and autonomous driving. By aligning its production schedule with the roadmaps of major global chip designers, Zhen Ding aims to secure its position as a primary supplier for the hardware backbone of the AI era.

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