Rumor
Hanmi Semiconductor may see extended TC bonder demand as HBM5 adoption of hybrid bonding faces delays
Friday, March 6, 2026 at 02:14 AM
The adoption of hybrid bonding in memory manufacturing may be delayed until after HBM5, extending the relevance of thermal compression (TC) bonders. This shift is reportedly due to TSMC packaging constraints that necessitate a relaxation of HBM height standards, making the transition to expensive hybrid bonding less urgent for manufacturers.
Context
The transition to bumpless hybrid bonding for next-generation High Bandwidth Memory appears to be slowing, as technical hurdles and cost concerns persist. While Samsung and SK Hynix initially targeted the HBM4E generation for hybrid bonding adoption, recent industry shifts suggest that existing thermal compression (TC) bonding may remain the primary method through HBM5 and potentially beyond. This delay is largely driven by JEDEC relaxing stack height standards to 775 microns, allowing manufacturers to continue using microbumps for 16-layer and 20-layer configurations without immediate thickness penalties.
This shift significantly benefits Hanmi Semiconductor, which dominates the TC bonder market with a 71.2% share. The company recently reported record annual revenue of 576.7 billion won and is preparing to launch its next-generation Wide TC Bonder in the second half of 2025. By extending the roadmap for traditional bonding, Hanmi Semiconductor is positioned to capture additional demand from major clients like Micron, which recently ordered 50 units, and SK Hynix, even as it continues R&D on its own hybrid bonding solutions for the long term.
Sources (11)
Decisive Battle in Hybrid Bonding: Key Insights and TrendsSamsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?Hybrid Bonder Race Heats Up for Next-Gen HBM
Hanmi Semiconductor wins $110 mn HBM equipment order from SK Hynix - KED GlobalHanmi Semiconductor Posts Record Results, Plans Next-Gen HBM Bonder Launch - Seoul Economic DailyHBM4 Sticks With Microbumps, Postponing Hybrid BondingScaling the Memory Wall: The Rise and Roadmap of HBM[News] SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration
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