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Taiwanese probe card and test interface makers expand capacity for AI and HPC demand
Saturday, February 28, 2026 at 04:04 AM
Taiwanese semiconductor test interface providers including Ingenic Semiconductor, Wintek, Chunghwa Precision Test, and Yung-Chi are significantly expanding production capacity to meet AI and HPC demand. Wintek is investing 3.5 billion TWD in a new Kaohsiung facility to triple capacity by late 2025, while Chunghwa Precision Test has raised funds for a third factory scheduled for 2028. Demand for vertical and MEMS probe cards is surging as testing becomes critical for yield and performance in advanced packaging and power-dense AI chips.
Context
Taiwanese semiconductor test interface leaders, including WinWay, MPI, and Chunghwa Precision Test (CHPT), are aggressively expanding capacity to meet surging demand for AI and High-Performance Computing (HPC). As chip designs grow increasingly complex, testing has transitioned from a backend cost to a critical factor for yield and performance. This strategic shift has driven stock prices for these firms above the 1,000 TWD mark, with sector leaders currently seeing order books full through 2026.
WinWay is investing 3.499 billion TWD in a new facility to triple capacity by late 2025, following a record 46.93 TWD EPS last year. Simultaneously, CHPT has raised 2.568 billion TWD to fund a third factory slated for 2028. Production of specialized components is scaling rapidly; monthly MEMS probe card output is expected to reach 3 million pins by late 2024, up from 1 million last year. These expansions signal a long-term growth cycle driven by the global AI hardware build-out and advanced packaging requirements.
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