Hitachi High-Tech to increase semiconductor metrology equipment production capacity by 50% due to AI demand
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Hitachi High-Tech to increase semiconductor metrology equipment production capacity by 50% due to AI demand

Tuesday, March 24, 2026 at 10:39 AM

Hitachi High-Tech is increasing its production capacity for semiconductor metrology and inspection equipment by 50% to meet rising demand driven by AI infrastructure. The expansion focuses on high-precision measurement tools necessary for advanced nodes and 3D packaging.

Context

As of March 2026, Hitachi High-Tech is significantly expanding its footprint in the semiconductor equipment market, driven by the explosive growth of generative AI and high-performance computing. The company is increasing its production capacity for semiconductor metrology equipment by 50% to meet the rigorous inspection demands of next-generation chips. This follows the successful 2025 opening of its automated, digitalized production facility in the Kasado area, which was specifically designed to scale the manufacturing of advanced etch and measurement systems. This capacity surge is critical as the industry transitions toward 2nm (N2) and 14-angstrom (A14) nodes, which utilize complex architectures like GAA (Gate All Around) and High-NA EUV lithography. Hitachi High-Tech, which holds the top global market share in CD-SEM (Critical Dimension-Scanning Electron Microscope) technology, is positioning its GT2000 metrology systems to solve the yield challenges associated with these ultra-fine 3D structures. By front-loading capital expenditure, the company aims to secure its dominance in the AI-driven supply chain.

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