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Micron expands memory roadmap with 256GB DRAM modules for data centers
Thursday, April 2, 2026 at 11:00 AM
Micron has released 256GB DRAM modules and is planning for further capacity expansion, indicating a trend toward higher memory consumption in data center environments.
Context
On March 3, 2026, Micron Technology announced it has begun shipping samples of the industry’s first 256GB SOCAMM2 memory modules. Built on a monolithic 32Gb LPDDR5X die using the advanced 1γ (1-gamma) process node, this modular solution is designed specifically for AI data centers and high-performance computing. By leveraging low-power mobile DRAM technology in a modular server form factor, Micron enables systems to scale up to 2TB of memory per 8-channel CPU, significantly expanding the capacity available for large language model inference and complex AI workloads.
This development is critical for reducing the total cost of ownership in power-constrained environments, as the SOCAMM2 consumes one-third the power and occupies one-third the footprint of traditional RDIMMs. The high-capacity modules improve real-time LLM performance by enhancing "time to first token" by more than 2.3 times through efficient KV cache offloading. Developed in collaboration with NVIDIA, this architecture is moving toward becoming an official JEDEC standard, positioning Micron as a first-to-market leader in the transition to energy-efficient, high-capacity modular server memory.
Sources (4)
Micron Sets New Benchmark With the World's First High-Capacity 256GB LPDRAM SOCAMM2 for Data Center Infrastructure | Micron TechnologySOCAMM2 | Micron Technology Inc.Micron unveils 256GB SOCAMM2, scaling AI server memory to 2TB per CPU
Micron ships the world's first 256GB LPDDR5X SOCAMM2 modules - OC3D
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