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Teradyne and MultiLane form joint venture for high-speed interconnect testing
Wednesday, February 4, 2026 at 07:33 AM
Teradyne and MultiLane have established a joint venture aimed at the high-speed I/O and interconnect testing market, focusing on enhancing semiconductor test capabilities for high-speed data transmission.
Context
Teradyne has entered into a joint venture with MultiLane to form MultiLane Test Products (MLTP), a new entity focused on the high-speed I/O and data center interconnect testing market. Announced on January 29, 2026, the transaction is expected to close in the first half of 2026. Teradyne will hold the majority ownership stake, absorbing MultiLane’s specialized test and measurement assets to offer a comprehensive testing suite that spans from the silicon wafer level to full-scale AI data center racks.
This strategic expansion addresses the critical bottleneck of high-bandwidth connectivity in AI infrastructure, where traditional testing methods struggle to keep pace with rapid interconnect evolution. The venture is expected to be accretive within 2026, supporting Teradyne’s full-year revenue guidance of $4.2 billion to $4.4 billion. By moving further into the data center hardware stack, Teradyne strengthens its competitive position against rivals like Advantest and Keysight in the lucrative AI-driven supply chain.
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