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SEMCO to supply FC-BGA substrates for NVIDIA Rubin NVLink switches

Friday, January 30, 2026 at 09:09 AM

Samsung Electro-Mechanics (SEMCO) will begin supplying Flip Chip Ball Grid Array (FC-BGA) substrates for NVIDIA's Rubin architecture NVLink switches, breaking the previous sole-supplier monopoly held by Ibiden.

Context

Samsung Electro-Mechanics has successfully broken the Japanese oligopoly in NVIDIA’s high-end substrate supply chain, securing a contract for Flip-Chip Ball Grid Array (FC-BGA) substrates used in the NV Switch. Historically dominated by Ibiden and Shinko Electric, this market entry marks a major strategic shift as Samsung Electro-Mechanics begins mass production at its Vietnam facility. These substrates serve as the critical "communication highway" allowing multiple GPUs to operate as a single, organic unit within NVIDIA’s AI infrastructure. The timing is pivotal, with mass supply beginning in the second half of 2026. NVIDIA’s advanced GB200 NVL72 rack systems require 18 NV Switches each, representing a high-volume, high-margin opportunity for the company. This partnership validates Samsung Electro-Mechanics’ top-tier circuit technology and yield stability, transitioning the firm from a general component maker to a core player in the global AI data center boom.

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