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Toray develops 160°C heat-resistant OPP film for IC substrate molding
Monday, January 26, 2026 at 08:14 PM
Toray has developed an OPP film with 160°C heat resistance for use in forming IC substrates.
Context
Toray has developed a breakthrough biaxially oriented polypropylene (OPP) film, branded as Torayfan, capable of withstanding temperatures up to 160°C. Traditionally, polypropylene is known for its low heat resistance, but this new iteration matches the performance of high-end engineering plastics. By providing a heat-stable alternative to expensive fluorine-based films, Toray is targeting critical needs in semiconductor manufacturing and carbon fiber reinforced plastic (CFRP) production where thermal durability is essential.
This innovation is a strategic move to address both cost reduction and tightening environmental regulations, specifically the global push toward "PFAS-free" (fluorine-free) materials. While fluorine films are costly and face increasing regulatory scrutiny, this new OPP film offers a low-cost, scalable solution. Toray expects the material to significantly streamline supply chains in the semiconductor sector by replacing specialized materials with a more affordable, high-performance general-purpose resin, with adoption expected to accelerate as manufacturers seek to de-risk their material sourcing.
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