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Denso partners with University of Tokyo on power semiconductor and wireless charging research
Monday, March 30, 2026 at 10:48 AM
Denso and the University of Tokyo have established a joint research agreement focused on advancing power semiconductor technologies and wireless power transfer systems for future energy infrastructure.
Context
On March 30, 2026, automotive giant Denso announced a new strategic partnership with the University of Tokyo to accelerate research into next-generation power semiconductors and wireless charging technologies. This collaboration aims to refine Silicon Carbide (SiC) power modules, which are essential for increasing the efficiency and range of electric vehicles. The partnership also targets the commercialization of Dynamic Wireless Power Transfer (DWPT) systems, building on preliminary field tests scheduled to begin in 2025.
This move follows a string of high-profile investments by Denso, including a $1.4 billion joint venture with Fuji Electric for SiC production and a recent development agreement with MediaTek for automotive SoCs. By leveraging the university's academic expertise in AI-driven production models and advanced materials, Denso seeks to secure its position in the competitive CASE (connected, autonomous, shared, and electric) vehicle market. This initiative aligns with Japan's broader AI Strategy 2023 to bridge the gap between academic research and industrial manufacturing.
Sources (6)
DENSO, Others Establish Social Cooperation Program at The University of Tokyo to Spur Mobility Innovations, Meet United Nations’ Sustainable Development Goals | Newsroom | News | DENSO Global WebsiteDenso and Fuji Electric to partner on SiC for EVs - Compound Semiconductor NewsSiC making further inroads into silicon for EV powertrainsCreating a university where international researchers want to stayPioneering Transformative Technologies Toward the ...Japan Robotics & AI Exec Education Market | 2019–2030 | Ken Research
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