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Toray develops polyimide sheet for glass core substrate processing and TGV filling
Monday, December 22, 2025 at 10:40 AM
Toray has developed a new photosensitive polyimide sheet designed for glass core substrates, enabling fine-line processing and the filling of through-glass vias (TGVs).
Context
Toray Industries has developed a specialized polyimide sheet designed for glass core substrates, a critical next-generation technology for AI and high-performance computing. This material is specifically engineered for the Through Glass Via (TGV) process, enabling the creation of fine-pitch circuitry on glass surfaces. By utilizing proprietary photosensitive technology, the sheet can be laminated and patterned directly, significantly streamlining the complex manufacturing process required for advanced semiconductor packaging.
The shift toward glass is accelerating as organic materials struggle with the thermal demands of AI workloads. Toray’s solution offers high adhesion and a low coefficient of thermal expansion, preventing warping during production. With commercialization targeted for 2025, the company is positioning itself as a vital supplier for the AI server market. This development aligns with the industry-wide move to adopt glass architectures for superior performance and higher interconnect density.
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