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Alchip Technologies reserves 60,000 monthly CoWoS wafers at TSMC for Amazon and Microsoft AI chips
Monday, March 30, 2026 at 01:16 AM
Alchip Technologies has reportedly secured 60,000 wafers per month of TSMC CoWoS advanced packaging capacity to support Amazon AWS's Trainium3 chip production. The 3nm Trainium3 project is expected to contribute approximately 75% of Alchip's annual revenue. Additionally, Alchip is assisting Microsoft with securing CoWoS capacity for its upcoming Maia 200 and 300 series chips.
Context
ASIC design partner Alchip Technologies has reportedly reserved 60,000 monthly CoWoS wafers at TSMC for 2026, marking a 200% year-on-year increase in capacity allocation. This massive reservation is primarily driven by the production of Amazon’s Trainium3 AI chips, which utilize TSMC’s 3nm (N3) process. Analysts estimate that Trainium3 orders could account for up to 75% of Alchip’s total revenue in the coming year as hyperscalers aggressively pivot toward in-house silicon to reduce reliance on Nvidia. In addition to the Amazon deal, Alchip is also securing capacity for Microsoft’s Maia 200/300 series accelerators, further solidifying its role as a critical intermediary in the AI supply chain. This move comes as TSMC projectstotal CoWoS capacity to reach approximately 120,000 wafers per month by late 2026, meaning Alchip has effectively locked down nearly half of the available global supply for its North American cloud clients. This strategic stockpiling highlights the intensifying "chip war" for advanced packaging, which remains the primary bottleneck for deploying next-generation AI infrastructure.
Sources (7)
[PDF] Alchip Technologies, Limited 2021 Annual ReportMaia 200: The AI accelerator built for inference - The Official Microsoft BlogTrainium3 UltraServers now available: Enabling customers to train ...1.15 Million Wafers to Determine 2026 "Chip War": Apple, MediaTek, and OpenAI Rush to JoinAmazon releases an impressive new AI chip and teases an Nvidia-friendly roadmap | TechCrunchExclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plansWhy Is Jensen Huang Getting Nervous About TSMC’s 3nm Shortage? | SemiWiki
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