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Mitsubishi Electric explores strategic options for power semiconductor business integration

Thursday, March 26, 2026 at 09:45 PM

Mitsubishi Electric addressed media reports regarding a potential consolidation or merger of its power semiconductor business. The company clarified that while it is exploring various strategic options to enhance the competitiveness of its power chip division, no final decision has been made yet.

Context

On March 26, 2026, reports emerged that Mitsubishi Electric, Rohm, and Toshiba are entering negotiations to integrate their power semiconductor businesses. This potential merger aims to create the world’s second-largest power chip group, trailing only Germany’s Infineon. The move is viewed as a strategic response to enhance cost competitiveness and counter a $8.3 billion buyout bid for Rohm recently initiated by Denso, a major Toyota supplier. While Mitsubishi Electric acknowledged it is considering various options to strengthen its competitiveness, the company stated that no official decision has been reached yet. The consolidation talks follow Mitsubishi Electric’s aggressive expansion into next-generation materials, including the October 2025 completion of a new silicon carbide (SiC) plant in Kumamoto and its September 2024 transition to 12-inch silicon wafer production. This shift is critical as the industry moves toward high-efficiency power modules for electric vehicles and renewable energy. Regarding the integration reports, Mitsubishi Electric issued a statement via its corporate channels: "While it is true that we are conducting various studies to strengthen the competitiveness of our power semiconductor business, there are no new matters decided at this time."

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