News
Rohm to internalize 650V GaN production following TSMC foundry exit
Monday, February 2, 2026 at 10:04 PM
Rohm has decided to move its 650V GaN power device production in-house following TSMC's decision to exit the GaN foundry business by 2027. Rohm will receive a license for the 650V technology from TSMC and plans to establish an 8-inch production line at its Rohm Hamamatsu subsidiary. Previously, Rohm produced 150V GaN devices internally but outsourced the higher-voltage 650V products to TSMC.
Context
Rohm is transitioning to in-house production of 650V GaN power semiconductors following a strategic license acquisition from TSMC. This move follows TSMC’s decision to fully exit the GaN foundry market by July 31, 2027, as the company redirects manufacturing capacity toward more profitable AI processors. While Rohm previously outsourced its GaN device manufacturing to the Taiwanese foundry, this license allows the Japanese firm to integrate production into its own vertically integrated system, securing a reliable supply for the growing electric vehicle and industrial sectors.
This industry-wide supply chain restructuring has forced other major designers to find new fabrication partners. Navitas has entered a long-term agreement with GlobalFoundries, which similarly acquired a TSMC license for 650V and 80V GaN technology. GlobalFoundries expects to begin volume production in Vermont by late 2026. With the global GaN power device market projected to reach $3.51 billion by 2030, these maneuvers represent a critical shift toward localized and diversified production to meet surging demand for high-efficiency AI and green energy infrastructure.
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