News
SEMES secures hybrid bonder contract with Samsung Electronics for HBM4 production
Thursday, February 19, 2026 at 11:49 PM
SEMES has reportedly secured a contract for hybrid bonding equipment and is in final testing stages before mass production. The equipment, a Die-to-Wafer (D2W) hybrid bonder, is being evaluated for HBM manufacturing. Sources indicate that the customer is Samsung Electronics, and the equipment was used to produce Samsung's HBM4 samples. Samsung plans to implement hybrid bonding starting with HBM4E as it transitions from its current TC-NCF process.
Context
SEMES has secured a supply contract for D2W (Die-to-Wafer) hybrid bonders, reportedly with Samsung Electronics, as the company nears mass production for next-generation AI memory. This equipment is essential for high-precision stacking in HBM4 and HBM4E architectures. Samsung has already utilized SEMES hardware to produce initial HBM4 samples, signaling a strategic transition from its current TC-NCF packaging method toward advanced hybrid copper bonding to meet evolving performance demands.
This partnership is vital for Samsung to maintain competitiveness in the high-end server market against rivals. By integrating this technology, the firm aims to significantly enhance thermal performance and interconnect density. While the evaluation and reliability testing process typically spans two years, the transition is moving toward full-scale supply, with partial commercialization of hybrid-bonded products expected to begin during the HBM4E production cycle.
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