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Samsung to start HBM4 mass production with HBM4E samples following in late 2026
Tuesday, January 27, 2026 at 10:11 AM
Samsung plans to begin mass production and shipment of HBM4 memory, with subsequent HBM4E sample shipments expected by the second half of 2026.
Context
Samsung Electronics has officially commenced mass production and shipping of its next-generation HBM4 memory, claiming an industry-first milestone in the high-stakes AI supply chain. This move signals an aggressive push to reclaim market leadership from key rivals in the memory sector. Following this initial rollout, the company plans to begin shipping samples of its even more advanced HBM4E technology by the second half of 2026, solidifying its long-term roadmap for future high-performance computing needs.
The transition to HBM4 is critical as it introduces a 2x increase in interface width and significantly improved power efficiency compared to current HBM3E standards. By integrating advanced logic dies, Samsung aims to provide highly tailored memory solutions for major clients like NVIDIA. This accelerated timeline addresses the massive bandwidth demands of upcoming AI hardware, positioning the company to capture a larger share of the lucrative data center market as production scales.
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