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SK Hynix, Applied Materials, and Besi partner to scale hybrid bonding for memory
Friday, April 3, 2026 at 07:23 AM
SK Hynix is collaborating with Applied Materials and Besi to co-optimize hybrid bonding technology for next-generation memory scaling. This partnership aims to transition hybrid bonding from logic applications to high-volume memory manufacturing, facilitating advanced packaging for HBM and other memory architectures.
Context
As of April 2026, memory giant SK Hynix has entered a strategic co-optimization partnership with Applied Materials and BE Semiconductor Industries (Besi) to scale hybrid bonding for next-generation AI memory. This collaboration leverages Applied Materials' 9 percent stake in Besi—acquired in early 2025—and their jointly developed Kinex system, the industry's first fully integrated die-to-wafer hybrid bonding tool. This system streamlines surface preparation, bonding, and metrology into a single process to drive higher yields for high-density chip stacking.
This shift is critical as the industry transitions toward HBM4E and 300-layer V10 NAND, where traditional micro-bumps hit physical scaling limits. Hybrid bonding enables direct copper-to-copper connections, significantly reducing package thickness while enhancing thermal performance and interconnect density. While SK Hynix previously favored MR-MUF technology, this tri-party alliance signals an aggressive move to secure a leadership position in the AI memory supercycle against rivals like Samsung, who are also accelerating hybrid bonding roadmaps.
Sources (9)
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBMApplied Materials Announces a Strategic Investment in BEApplied and Besi unveil integrated die-to-wafer hybrid bonder - Bits&Chips[News] Industry Weigh 825–900 μm HBM Thickness for 20-High Stacks, Potentially Slowing Hybrid BondingSamsung to adopt hybrid bonding for HBM4 memory | Tom's HardwareAI Demand Resets Memory Market Priorities, Tightening ...Applied Materials and SK Hynix Forge R&D Pact to Accelerate Next ... Hybrid Bonding Trends Transforming Next-Gen Chip Packaging
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