Rumor

Besi hybrid bonding equipment utilized for Apple M5 chip SoIC packaging

Sunday, February 1, 2026 at 05:50 AM

Besi's hybrid bonding equipment is reportedly being used for the SoIC packaging of Apple's upcoming high-end M5 chip, building on established industry expectations for the device's manufacturing process.

Context

Apple is set to integrate BESI’s advanced hybrid bonding equipment into the production cycle for its next-generation M5 high-end chips. By leveraging TSMC’s SoIC (System on Integrated Chips) packaging technology, Apple aims to achieve superior performance and power efficiency through 3D stacking. This transition highlights a strategic shift toward advanced chiplet architectures, which are essential for supporting intensive AI workloads and maintaining dominance in the premium hardware sector. The adoption of BESI’s tools marks a significant milestone for the Dutch equipment manufacturer, solidifying its role in the global semiconductor supply chain. Mass production of the M5 is projected to commence in the second half of 2025, coinciding with a massive expansion of SoIC capacity at TSMC’s specialized facilities. For investors, this deployment signals a robust growth runway for BESI as hybrid bonding moves from niche high-performance computing into high-volume consumer electronics.

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TSMC

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BESI