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Intel reports elimination of micro-cracks in glass substrate manufacturing
Thursday, January 22, 2026 at 08:30 PM
Intel announced a significant breakthrough in glass substrate manufacturing during NEPCON Japan, reporting the elimination of micro-cracks (SeWaRe) caused by stress between core and build-up layers. The company confirmed these glass-core substrates are being produced using 510x510 mm panels.
Context
Intel reached a pivotal milestone in glass substrate manufacturing, reporting at NEPCON Japan 2026 that it has eliminated "SeWaRe," or structural micro-cracks. These cracks, caused by stress between the core and build-up layers, were a primary barrier to high-volume production. By achieving a "No SeWaRe" state on 510x510 mm panels, the company has proven the mechanical stability required for advanced semiconductor packaging.
This breakthrough is vital for the AI supply chain, as glass substrates offer superior thermal management and interconnect density over traditional organic materials. As chip sizes grow, this technology becomes essential for next-generation high-performance processors. Intel remains ahead in this transition, aiming for commercial implementation toward the end of the decade, potentially providing a major competitive edge in the foundry and data center markets.
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