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Denso joins Mitsubishi Electric, Rohm, and Toshiba in power semiconductor manufacturing alliance
Friday, March 6, 2026 at 03:26 AM
Denso has reportedly joined a power semiconductor alliance involving Mitsubishi Electric, Rohm, and Toshiba to strengthen the domestic supply chain and manufacturing competitiveness in Japan.
Context
On March 26, 2026, reports emerged that Mitsubishi Electric, Rohm, and Toshiba have entered tripartite negotiations to integrate their power semiconductor businesses. This move aims to create a Japanese "national team" to compete against dominant Western and Chinese rivals in the high-growth Silicon Carbide (SiC) and IGBT markets. The potential alliance follows a massive 1.3 trillion yen ($8.3 billion) full acquisition proposal for Rohm by automotive tier-one giant Denso earlier this month.
The consolidation is a strategic response to heightening global competition and the need for massive R&D scaling in electric vehicle (EV) power modules. Rohm has reportedly established a special committee to weigh the benefits of the Denso acquisition against the three-way manufacturing integration. If the Mitsubishi-Toshiba-Rohm merger proceeds, it would unite three of Japan's largest power chip players to secure supply chain resilience and cost-competitiveness against leading firms like Infineon and STMicroelectronics.
Sources (10)
DENSO to Exhibit at JAPAN MOBILITY SHOW 2025 | Newsroom | News | DENSO Global WebsiteToshiba's China SiC turn triggers Japan's power-chip interventionRohm, Toshiba, Mitsubishi Electric Eye Power Chip ...Mitsubishi Electric Eyes Power Semiconductor Alliance in JapanDirect Purchaser Plaintiffs' Motion for Final Approval of ...Rohm, Toshiba, Mitsubishi Electric eye power chip integrationThree Japanese Tech Giants Eye Merger to Create Global ...Nikkei reports that Rohm Toshiba and Mitsubishi Electric will begin talks to integrate power chips.
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