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ROHM releases roadmap detailing progress on power semiconductor manufacturing targets
Friday, March 27, 2026 at 08:55 AM
ROHM Semiconductor has released updated roadmap materials outlining their progress and future targets for power semiconductor manufacturing and SiC production capacity expansion.
Context
Japanese semiconductor leader ROHM has unveiled its updated strategic roadmap under the “MOVING FORWARD to 2028” management plan, following a period where the company expected to miss previous financial targets due to inventory adjustments. The new strategy focuses on fundamental structural reforms to become a Top 10 global player in power and analog semiconductors by 2035. Central to this plan is the expansion of Silicon Carbide (SiC) and Silicon (Si) power device production through a high-profile manufacturing collaboration with Toshiba, which was officially recognized by Japan’s Ministry of Economy, Trade and Industry as a critical initiative for stable supply chains.
To drive growth, ROHM is aggressively targeting the AI server market, aiming for ¥30 billion in related sales by FY2030. This expansion is supported by the acquisition of the former Solar Frontier plant to accelerate capacity by approximately two years compared to greenfield construction. Tetsuhiro Tanabe, Executive Officer and Director of Si Power Devices Business Headquarters, emphasized this shift, stating that the company will "reinforce our lineup of high value-added products, such as MOSFETs for AI servers that have won high praise throughout the world, and increase our competitiveness to capture global markets."
Sources (6)
ROHM Integrated Report 2025Investor Relations ROHM Semiconductor - ROHM Co., Ltd.onsemi - onsemi and Innoscience Announce Plans to Collaborate to Speed Global Rollout of GaN Power Portfolio GaN SiC Power Semiconductor Market Outlook 2026-2032[PDF] GaN and SiC - Power Electronics NewsWhat is Growth Strategy and Future Prospects of ROHM Co. Company? – MatrixBCG.com
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