Rumor
Mitsui Kinzoku outlines production plans for specialized copper foils in AI server applications
Monday, December 22, 2025 at 04:00 AM
Mitsui Kinzoku has detailed its production capacity and sales plans for specialized copper foils, including MicroThin carrier-attached copper foil and VSP high-grade HVLP copper foil. The company also provided long-term market demand forecasts and highlighted application cases for these materials within AI server architectures.
Context
Mitsui Kinzoku is aggressively expanding its specialized copper foil capacity to capture the surge in AI server infrastructure demand. The company’s VSP™ (Hyper Very Low Profile) series, which is essential for maintaining signal integrity in high-speed Nvidia-class AI servers and networking switches, is currently transitioning from development to large-scale mass production.
To address an accelerating supply gap, the firm has raised its production targets to reach 840 tons per month by September 2026, a 45% increase over its previous expansion plans. This ramp-up will be executed across facilities in Taiwan and Malaysia, with intermediate capacity milestones of 620 tons by August 2025 and 720 tons by March 2026.
The strategic push follows a significant upward revision to the company’s FY2025 operating income forecast, which was increased by 32 billion yen due to robust orders for both VSP™ and MicroThin™ products. Analysts expect Mitsui Kinzoku to maintain its dominant market position as high-end circuit board layers increase from 20 to over 30 in next-generation AI hardware.
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