News
Fujibo Holdings to invest 5.3 billion yen for semiconductor polishing material production in Oita
Monday, March 16, 2026 at 09:03 AM
Fujibo Holdings is investing 5.3 billion yen to construct a new building at its Oita plant to increase production of chemical mechanical polishing (CMP) pads used in semiconductor manufacturing.
Context
Fujibo Holdings is investing 5.3 billion yen to construct a new production building at its Oita Plant in Japan, specifically to increase the output of polishing pads used in semiconductor manufacturing. This expansion is a key component of the company’s “Shinka 26-30” medium-term management plan, which targets a total of 48 billion yen in capital expenditures through fiscal year 2030. The new Oita facility is scheduled to begin operations in the second half of fiscal year 2028, aiming for a 50%+ capacity expansion for its polishing materials. This strategic move follows the company’s efforts to capture growing demand driven by semiconductor miniaturization and the rise of SiC power electronics. The investment aligns with the broader revitalization of Kyushu as a semiconductor hub, supported by major nearby developments from firms like TSMC and Sony. By scaling its high-precision CMP pads, Fujibo Holdings intends to secure its position as a critical supplier to the top five global wafer manufacturers and major foundry players.
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