News
Nvidia accelerates co-packaged optics roadmap with TSMC-manufactured 115.2T switches and optical scale-up for 2027
Wednesday, February 4, 2026 at 10:58 PM
Analysis of NVIDIA's co-packaged optics (CPO) roadmap reveals an accelerated transition for Scale-out switches and potential optical interconnects in NVL576 architecture by 2027. Coherent and Lumentum have secured significant CW Laser orders for 2026-2027 production, while TSMC is expected to manufacture the CPO components for NVIDIA's next-generation 115.2T switches. Browave is positioned as a key supplier for CPO shuttle boxes with volume ramp expected in 2Q26.
Context
Nvidia is aggressively accelerating its optical roadmap, shifting toward co-packaged optics (CPO) to bypass the physical limits of copper. By 2026, Nvidia is expected to launch a TSMC-manufactured 115.2T switch, with shipment projections jumping from 20,000 units in 2026 to 80,000 in 2027. This transition focuses on achieving superior thermal management and bandwidth density, which are essential for the massive scale-out requirements of next-generation AI clusters.
The supply chain is already seeing substantial financial commitments, with Lumentum and Coherent reporting hundreds of millions of dollars in orders for laser components starting in late 2026. This shift extends to Nvidia’s upcoming Rubin Ultra architecture, which will likely adopt optical scale-up interconnects to replace copper in rack-to-rack environments. Key beneficiaries include Browave, which currently controls 50% of the CPO Shuttle Box market. These moves signal that 2027 will be the definitive inflection point for mass-market optical integration.
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