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Adeia maintains hybrid bonding licensing agreements with major semiconductor manufacturers including Samsung, TSMC, and Intel

Sunday, March 8, 2026 at 01:54 AM

A comprehensive list identifies major semiconductor companies that have entered into hybrid bonding licensing agreements with Adeia (formerly known as Xperi/Ziptronix). Hybrid bonding is a critical technology for advanced packaging and 3D chip stacking.

Context

The intellectual property firm Adeia has solidified its position at the center of the semiconductor supply chain by maintaining hybrid bonding licensing agreements with industry titans including Samsung Electronics, TSMC, Intel, SK Hynix, and UMC. These agreements cover foundational Direct Bond Interconnect (DBI) and ZiBond technologies, which are essential for stacking chiplets and high-bandwidth memory (HBM). By replacing traditional solder bumps with direct copper-to-copper connections, Adeia's IP enables the high-density integration required for modern AI and high-performance computing processors. While Adeia continues to sign new partners like Hamamatsu Photonics, it is also aggressively defending its portfolio through litigation. In November 2025, the company filed patent infringement lawsuits against AMD, alleging the unauthorized use of 10 patents in products like the Ryzen X3D series. This legal strategy highlights the critical nature of hybrid bonding as the industry moves beyond monolithic chip designs toward advanced 3D packaging architectures where Adeia holds significant leverage.