News
Hanmi Semiconductor introduces Wide TC Bonder for HBM5 and HBM6 manufacturing
Wednesday, February 11, 2026 at 01:58 AM
HANMI Semiconductor has introduced its Wide TC Bonder equipment designed to support the manufacturing of next-generation high bandwidth memory, specifically targeting HBM5 and HBM6 production requirements.
Context
Hanmi Semiconductor is set to launch its next-generation Wide TC Bonder in the second half of 2026, specifically targeting the production of HBM5 and HBM6 memory. This equipment represents a strategic shift toward horizontal die expansion as traditional vertical stacking approaches their physical stability limits beyond 20 layers. By widening the chip area, the tool enables higher memory density and improved thermal efficiency, providing a critical manufacturing solution for the increasingly demanding requirements of artificial intelligence semiconductors.
The new equipment features advanced fluxless bonding technology, which eliminates the need for residue cleaning and reduces overall package thickness. This positioning is designed to bridge the gap before the mass-market commercialization of hybrid bonding, which is not expected to dominate 16-stack configurations until roughly 2029. Hanmi Semiconductor currently holds a dominant 71.2% share of the high-bandwidth memory bonding market and recently reported record annual revenue of 576.7 billion won with a high operating margin of 43.6%.
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Hanmi Semiconductor
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