Samsung diversifies TC bonder supply chain, engages ASMPT and Besi for advanced packaging
Tuesday, January 20, 2026 at 11:24 PM
Samsung Electronics is diversifying its supply chain for thermo-compression (TC) bonders and exploring new partnerships for hybrid bonders, engaging with ASMPT and BE Semiconductor Industries (Besi). This move aims to secure alternatives for advanced packaging processes, including HBM and system semiconductors, beyond its current suppliers Semes and Shinkawa.