News
Daifuku to expand semiconductor material handling equipment production, targeting over 300 billion yen in sales
Monday, January 19, 2026 at 09:09 AM
Daifuku president Tomoaki Terai stated that the company plans to expand production of semiconductor material handling equipment, aiming for sales exceeding 300 billion yen.
Context
Daifuku, a global leader in automated material handling, is launching large-scale transport and assembly equipment to meet the specialized needs of AI semiconductor production. As AI chip architectures evolve toward advanced packaging—integrating stacked high-bandwidth memory (HBM) and multi-die chiplets—the physical size and weight of processing units have increased. This new equipment is engineered to handle these heavier modules during the back-end assembly phase, providing a solution where traditional wafer-handling tools are no longer sufficient.
The strategic rollout targets a market segment projected to see robust growth through 2025 as major foundries and OSAT providers expand their AI-specific capacities. By providing specialized infrastructure for advanced packaging, Daifuku is positioning itself as a critical link in the AI supply chain. This move allows the company to capitalize on the industry's shift toward complex back-end processing, securing high-margin demand as global tech giants race to increase AI hardware output.
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