Rumor
Chinese Equipment Maker NAURA Reportedly Developing 300-Layer Class Etching Tool for 3D NAND
Monday, December 8, 2025 at 02:20 AM
Chinese semiconductor equipment producer NAURA is rumored to be developing an advanced 300-layer class etching system, a key technology for high-density 3D NAND memory.
Context
UBS has reportedly raised its 2026/2027 WFE revenue forecasts for NAURA by 1% and 8% respectively, following indications of significant progress in 90:1 high-aspect ratio etching technology. This breakthrough could enable the production of 300+ layer 3D NAND flash, marking a crucial step in China's efforts to localize advanced semiconductor manufacturing equipment.
This development is significant as it suggests NAURA is advancing its capabilities to meet the demanding requirements of next-generation memory production. If domestic orders materialize, this could unlock an incremental market opportunity valued at "hundreds of millions or billions" of dollars for the company. The potential for validation and early revenue impact is anticipated from late 2025 into 2026/2027, further bolstering China's domestic supply chain for critical chip components.
Related Companies
A
Advanced Micro-Fabrication Equipment Inc. China
Naura Technology
002371