Rumor
SK Hynix reportedly orders HBM4 TC bonders from ASMPT
Wednesday, December 10, 2025 at 08:50 AM
SK Hynix reportedly placed a new order last month for seven sets of Thermal Compression (TC) bonders from ASMPT for HBM4 mass production, valued at approximately 30 billion KRW. The memory maker also plans to order about 100 additional HBM4 TC bonder sets by next March as it expands 1b DRAM volume.
Context
SK Hynix has reportedly placed a new order for 7 sets of ASMPT's Thermal Compression (TC) bonders for HBM4 manufacturing, estimated at ~30 billion KRW. This move signals SK Hynix's continued strategy to diversify its TC bonder suppliers, following previous HBM3E orders with ASMPT. The company's current HBM4 TC bonder base is less than 50 sets, with ASMPT now holding a significant share.
This order comes amidst an ongoing legal battle between traditional suppliers Hanmi Semiconductor and Hanwha Semitech over patent disputes, which has reportedly influenced SK Hynix's sourcing decisions. Hanmi Semiconductor had previously been the sole supplier, but ASMPT's role has expanded, and Hanwha Semitech also recently received orders. The diversification aims to secure stable equipment supply for critical HBM production.
Looking ahead, SK Hynix plans to order approximately 100 sets of HBM4 TC bonders around March 2026. HBM4 is crucial for Nvidia's next-generation AI semiconductor 'Rubin', slated for release in the second half of 2026, highlighting the strategic importance of these equipment orders for future AI infrastructure.
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