Rumor

Broadcom increases 2026 TPU volume as CoWoS allocation rises while AWS capacity is cut for Nvidia

Friday, December 5, 2025 at 02:58 AM

Broadcom has reportedly secured an additional 20,000 units of CoWoS capacity for 2026, raising its projected TPU production volume from 4 million to 4.3 million units. Conversely, AWS had its 2026 CoWoS allocation reduced to accommodate increased demand from Nvidia.

Context

Broadcom has secured a significant increase in its 2026 CoWoS packaging allocation, effectively debunking recent rumors of a capacity reduction. The company’s allocation was reportedly raised by approximately 20,000 wafers in the last month, leading to an upward revision of its total TPU volume forecast from 4 million to 4.3 million units. This expansion signals robust demand for custom AI silicon and reinforces Broadcom's critical role in the high-end semiconductor supply chain. In a strategic reshuffle to meet the overwhelming demand for Nvidia’s AI hardware, AWS saw its 2026 capacity allocation cut. This maneuver suggests that while cloud providers like Amazon are scaling their own silicon, manufacturers are currently prioritizing Nvidia's massive market footprint. For investors, these adjustments highlight the ongoing bottleneck in advanced packaging and confirm Broadcom’s ability to maintain competitive priority over other major tech players for essential production resources.

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