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Texas Instruments launches high-density isolated DC/DC modules for electric vehicles and data centers
Wednesday, March 25, 2026 at 07:40 AM
Texas Instruments has introduced two new high-density isolated DC/DC power modules designed for applications in electric vehicles and data center infrastructure, aiming to improve power efficiency and density in critical power systems.
Context
On March 23, 2026, Texas Instruments (TI) unveiled its new UCC34141-Q1 and UCC33420 isolated power modules at the Applied Power Electronics Conference (APEC). These high-density DC/DC modules utilize proprietary IsoShield technology, a multichip packaging solution that achieves up to three times higher power density than discrete alternatives. By integrating the transformer and silicon into a single package, the modules can shrink solution size by as much as 70%, addressing critical space constraints in modern hardware designs.
This launch is a strategic component of Texas Instruments' broader push into the AI and electric vehicle (EV) supply chains. The modules are designed to support the 800 VDC power architecture TI recently developed in collaboration with NVIDIA for next-generation AI data centers. By increasing efficiency and reducing material costs, these components help scale power-management for high-performance computing racks and 300kW traction inverters in EVs, where minimizing weight and footprint is essential.
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