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Ericsson partners with Intel for custom chips using 1.8nm process node
Tuesday, February 24, 2026 at 08:17 PM
Ericsson is collaborating with Intel to develop custom semiconductors for the AI era using Intel's 18A (1.8nm class) manufacturing process technology.
Context
Ericsson has expanded its strategic partnership with Intel to develop custom 5G system-on-chips (SoCs) using the cutting-edge 1.8nm process node, known as 18A. This collaboration is a cornerstone of Intel’s "five nodes in four years" roadmap, designed to reclaim semiconductor manufacturing leadership from rivals by 2025. The new custom silicon will utilize PowerVia backside power delivery and RibbonFET architecture, which are expected to deliver a 10% improvement in performance-per-watt for future 5G and AI networking infrastructure.
The move provides Ericsson with a more resilient supply chain and high-performance hardware for its cloud-based radio access network (Cloud RAN) solutions. While Intel began risk production of the 18A node in April 2025, high-volume manufacturing for external foundry customers is projected to ramp up throughout 2026. Beyond chip production, the two firms are also exploring deeper financial ties, with Ericsson reportedly considering a minority investment of several hundred million dollars in Intel’s network and edge business unit to solidify their long-term infrastructure roadmap.
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