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JTEKT Thermo System Launches New Heat Treatment Equipment for Advanced Packaging
Thursday, December 11, 2025 at 11:21 AM
JTEKT Thermo System announced the launch of its new "SO2-60-F" heat treatment apparatus for advanced semiconductor packaging. It is designed to support the manufacturing of RDL and glass interposers, handling panel sizes up to □600 × 600mm.
Context
On December 11, 2025, JTEKT Thermo System, a subsidiary of JTEKT Group, launched its new heated-air circulating clean oven model, the SO2-60-F. This equipment is specifically designed for advanced semiconductor packaging, including RDL/re-wiring-layer interposers, glass interposers, and Si interposers, addressing the growing demand from AI and 5G packaging.
The SO2-60-F supports square substrates of 510x515 mm and 600x600 mm, and is also compatible with 300 mm wafers. It operates within a temperature range of 70-350°C, with an optional extension to 70-400°C, and can process a batch of 24 wafers. The unit features a high-sealing structure for low-oxygen processing, enhanced temperature uniformity, and stable handling of large substrates, ensuring high-precision heat treatments like polyimide curing. JTEKT aims to supply the SO2-60-F to semiconductor manufacturers, while continuing to offer other size variants.
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