Rumor
Broadcom ships industry first 2nm 3.5D Face-to-Face compute SoC for Fujitsu
Thursday, February 26, 2026 at 02:54 PM
Broadcom has shipped the industry first 3.5D Face-to-Face compute SoC designed for Fujitsu. The chip is based on the 2nm process node and utilizes the 3.5D eXtreme Dimension System in Package (XDSiP) platform, which integrates 2.5D technology and Face-to-Face (F2F) 3D-IC packaging. This hardware will power the FUJITSU-MONAKA processor.
Context
Broadcom has shipped the industry’s first 2nm compute SoC to Fujitsu, marking a major leap in the race for next-generation AI infrastructure. The chip utilizes Broadcom’s proprietary 3.5D eXtreme Dimension System in Package (XDSiP) platform, which fuses 2.5D technology with 3D-IC Face-to-Face (F2F) integration. This delivery validates the commercial readiness of 2nm process nodes, offering a significant density and power advantage over current 3nm standards used in high-end data centers.
The silicon is destined for the FUJITSU-MONAKA processor, designed to tackle high-performance computing and AI workloads with extreme energy efficiency. By implementing Face-to-Face stacking, the SoC minimizes data latency and maximizes throughput between compute dies. This partnership reinforces Broadcom’s leadership in custom silicon (ASICs) and positions Fujitsu as a key contender in the global AI hardware market ahead of the processor’s expected 2027 rollout.
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