MediaTek reportedly caps 2026 TPU shipments at 400,000 units while AMD evaluates Broadcom co-packaged optics
Rumor

MediaTek reportedly caps 2026 TPU shipments at 400,000 units while AMD evaluates Broadcom co-packaged optics

Wednesday, March 18, 2026 at 02:23 AM

Industry reports suggest MediaTek will limit its TPU shipments to 400,000 units in 2026. Furthermore, the company's Zebrafish project is reportedly delayed and has not yet entered the testing phase. Separately, AMD is rumored to be considering Broadcom's co-packaged optics (CPO) technology for its future hardware.

Context

Reports indicate that MediaTek is expected to ship 400,000 units of its Google TPU v7e product line in 2026, a figure that reflects the initial ramp of its high-stakes ASIC partnership with Google. This production target is part of a longer-term trajectory where MediaTek aims to scale shipments to 2 million units by 2027 and potentially capture up to $10 billion in ASIC revenue. While the company's Zebrafish project remains a focal point for future diversification, current constraints in CoWoS packaging and memory supply continue to cap the industry's near-term production ceiling for advanced AI accelerators. Simultaneously, AMD is evaluating the integration of Broadcom's third-generation Co-Packaged Optics (CPO) technology for its next-generation Instinct series. As power consumption from traditional copper interconnects becomes a bottleneck for large-scale AI clusters, AMD's participation in the newly formed Optical Compute Interconnect (OCI) Multi-Source Agreement alongside Broadcom and Meta signals a strategic shift toward optical-centric architectures. This collaboration aims to deliver up to 65% savings in transceiver power, which is critical as AMD's upcoming MI400 GPUs compete against Nvidia's Rubin platform in 2026.

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