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TSMC approves $4.7 billion in capital expenditure for AI packaging amid bottlenecks

Tuesday, January 27, 2026 at 09:04 AM

TSMC's board of directors reportedly approved $4.7 billion in CapEx, separate from the $45 billion approved in Q1, which was $17 billion in 1Q25, indicating significant investment in AI packaging to address bottlenecks.

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