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NVIDIA and TSMC Announce First US-Made Blackwell Wafer Production at Arizona Fab

Saturday, October 18, 2025 at 06:48 AM

NVIDIA's CEO and TSMC executives celebrated the first Blackwell architecture wafer being produced at TSMC's Phoenix, Arizona facility, marking a major milestone in onshore US advanced semiconductor manufacturing. This signifies a volume production step for NVIDIA's next-generation AI chip using TSMC's 4nm-class process, bolstering the domestic supply chain for critical AI infrastructure.

Context

In a major milestone for the U.S. AI supply chain, Nvidia and TSMC unveiled the first Blackwell chip wafer produced on American soil in October 2025 at TSMC’s new Phoenix, Arizona, facility. The event signals that Nvidia's next-generation architecture, which is critical for powering future AI data centers, has officially entered volume production. This achievement is a landmark step in on-shoring advanced semiconductor manufacturing and a key outcome of TSMC's $165 billion investment in its Arizona complex. While a significant step, the supply chain is not yet fully localized. The complex wafers fabricated in Arizona must still be shipped to Taiwan for TSMC’s essential CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging before the chips are considered complete. This continued dependency on Taiwan for the final production step means geopolitical risks and logistical timelines remain key factors for investors. A fully domestic supply chain hinges on future U.S.-based packaging capabilities, such as a potential Amkor facility slated to begin production in 2026.

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