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Hanmi Semiconductor sees increased revenue from TC bonder sales in China
Friday, March 27, 2026 at 01:55 AM
Hanmi Semiconductor is experiencing significant revenue growth driven by strong sales of thermal compression (TC) bonders to Chinese customers for advanced chip packaging.
Context
As of March 2026, Hanmi Semiconductor is reporting record-breaking financial performance, driven by its dominant 71.2% global market share in thermal compression (TC) bonders. The company posted 2025 annual sales of 576.7 billion won and an exceptional operating margin of 43.6%. This growth is fueled by the surging demand for High-Bandwidth Memory (HBM) used in AI applications, where Hanmi Semiconductor serves as a critical supplier to industry leaders including SK hynix and Micron.
While the company has historically focused on South Korean and U.S. clients, it is now aggressively targeting the Chinese and Taiwanese markets. Hanmi Semiconductor plans to supply specialized big-die TC bonders and die bonders to foundries and Outsourced Semiconductor Assembly and Test (OSAT) companies in China. This expansion into the Chinese supply chain, combined with the upcoming launch of Wide TC Bonders for HBM5 and HBM6 production, positions the company to capitalize on the next generation of AI infrastructure.
Sources (8)
Annual Reports :: Hanmi Financial Corporation (HAFC)HANMI SemiconductorHanmi Semiconductor Declares Record $52M Dividend After Banner Year - Seoul Economic DailyHANMI Semiconductor supplies TC bonders to SK hynix to boost HBM production - CHOSUNBIZHanmi Semiconductor Achieves Record-High Sales in 2025 - The Asia Business DailyHanmi Semiconductor Enters AI Chip Market with ‘Big Die FC Bonder’ - BusinesskoreaHanmi Semiconductor wins order from Micron to supply 50 TC bonders - THE ELEC, Korea Electronics Industry MediaHanmi Semiconductor Reaffirms Status as Key Partner for Micron's Advanced Packaging Plant in India — BigGo Finance
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