Rumor
Samsung and SK Hynix accelerate HBM capacity expansion with new equipment orders and fab construction
Wednesday, January 14, 2026 at 12:05 AM
Samsung Electronics and SK Hynix are aggressively expanding HBM production capacity. SK Hynix has placed new orders for TC bonders from Hanmi Semiconductor and Hanwha Semitech for its Cheongju facility, targeting HBM4 production. Samsung aims to increase its HBM wafer capacity from 170,000 to 250,000 per month by year-end and is accelerating construction of its P4 and P5 fabs to meet rising AI demand.
Context
Samsung Electronics and SK Hynix are aggressively accelerating High Bandwidth Memory (HBM) production to secure dominance in the AI supply chain. SK Hynix recently initiated large-scale orders for TC bonders from Hanmi Semiconductor and Hanwha Semitech to support HBM4 manufacturing. Simultaneously, Samsung Electronics is restructuring existing facilities to increase monthly HBM wafer capacity by 47%, targeting 250,000 units by late 2025. These moves reflect a race for "idle space" optimization before next-generation mega-fabs come online.
The urgency stems from a rapidly expanding market, with Micron forecasting the HBM sector will reach $100 billion by 2028, three times its 2024 valuation. While immediate expansion involves retrofitting current plants like Samsung’s P4, the bulk of this massive investment—including the $360 billion Yongin cluster—is designed to satisfy demand through 2031. Investors should note that while equipment spending is peaking now, the most significant capacity contributions from these new "mega-fabs" are expected to materialize starting in 2028.
Related Companies
SK Hynix
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